X-ray Sensitive Time Delay Integration (TDI) Line-Scan Camera Products
The XTI12848 TDI Series Camera is designed for high-resolution (48 microns) radiographic in-line imaging applications at energy levels ranging from 15kV to 320kV.
The high energy HE version has been developed for applications requiring higher kV to penetrate thicker objects including batteries and welds.
A compact camera design combines scintillation for conversion of x-ray and gamma-ray photons to visible light, and fiber optics for conveying the visible light to a shielded, off-axis linear imaging diode array.
This design provides for field replaceable scintillators to provide easy servicing.
A collection of hardware for interfacing to computers and software including drivers, an intuitive application programming interface (API), example code software, and standard inspection application expedite developments of x-ray scanning systems.
Typical applications include PCB inspection, battery inspection, chip counting, continuous weld inspection and other Non-Destructive Testing (NDT) imaging where higher inspection rates and higher quality imaging are required.
